China
China HBM Access: The Stuck Step in the Domestic AI Stack
September 2026 in one line: MIIT wants 9,800 EFLOPS by 2030, Ascend cards just got much more expensive, and advanced HBM access is still the stuck step in China’s domestic AI stack.
Public tag for Taiwan Pulse semiconductor coverage
China
September 2026 in one line: MIIT wants 9,800 EFLOPS by 2030, Ascend cards just got much more expensive, and advanced HBM access is still the stuck step in China’s domestic AI stack.
Korea
September 2026 in one line: SK hynix's operating margin hit 76%, Korea's chip exports set another record, and HBM is still allocated to a short customer list. Who gets paid, and what dates change the read.
Taiwan
August 2026 in one line: TSMC sold NT$514.8bn, Taiwan shipped a record US$82.4bn, and packaging is still the step that sets the pace. Our Q3 math and the dates that matter.