China
China HBM Access: The Stuck Step in the Domestic AI Stack
September 2026 in one line: MIIT wants 9,800 EFLOPS by 2030, Ascend cards just got much more expensive, and advanced HBM access is still the stuck step in China’s domestic AI stack.
Markets
Korea
Korea HBM: Who Gets Paid When AI Memory Is Still Stuck
September 2026 in one line: SK hynix's operating margin hit 76%, Korea's chip exports set another record, and HBM is still allocated to a short customer list. Who gets paid, and what dates change the read.
Taiwan
TSMC Revenue, CoWoS and What's Next for Taiwan's AI Chips
August 2026 in one line: TSMC sold NT$514.8bn, Taiwan shipped a record US$82.4bn, and packaging is still the step that sets the pace. Our Q3 math and the dates that matter.
Taiwan
TSMC, CoWoS Capacity and the Packaging Gate
Taiwan owns the AI finish line. Why a CoWoS capacity number means nothing without its variant, and what would show the packaging gate finally loosening.
US
CoreWeave and How Neocloud Contracts Become Cash
A contracted backlog is not revenue. How neocloud contracts convert to cash, what the financing structure does to the risk, and what would break the model.
Korea
SK Hynix and the HBM Allocation Cycle
Korea holds the largest share of AI-class HBM output. How the allocation cycle turns into cash, and the four disclosures that tell you whether it is still tight.